Title:
POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2001215698
Kind Code:
A
Abstract:
To provide a positive type photosensitive resin composition excellent in adhesion to metal copper after curing, and a semiconductor device using the composition.
The positive type photosensitive resin composition comprises 100 pts.wt. polyamide (A), 1-100 pts.wt. photosensitive diazoquinone compound (B) and 0.05-20 pts.wt. organotitanium-based compound (C).
Inventors:
YAMAMOTO KAGEHISA
HIRANO TAKASHI
HIRANO TAKASHI
Application Number:
JP2000021105A
Publication Date:
August 10, 2001
Filing Date:
January 31, 2000
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
H01L21/027; C08L77/06; G03F7/004; G03F7/027; G03F7/031; G03F7/039; (IPC1-7): G03F7/027; C08L77/06; G03F7/004; G03F7/031; G03F7/039; H01L21/027