Title:
POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM PREPARED THEREFROM
Document Type and Number:
Japanese Patent JP2021009361
Kind Code:
A
Abstract:
To provide a positive-type photosensitive resin composition and a cured film prepared therefrom.SOLUTION: The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition introduces a multifunctional monomer into a positive-type photosensitive resin composition comprising a mixed binder, in which a siloxane copolymer is added to an acrylic copolymer, whereby the penetration of a developer into the binder can be facilitated at the time of development of a pre-baked film to increase the solubility in the developer, thereby further enhancing the pattern developability and sensitivity. Further, a cured film prepared from the composition has excellent appearance characteristics without a rough surface of the film and a scum or the like at the bottom of the film during development.SELECTED DRAWING: None
Inventors:
KIM YEONOK
HUH GEUN
JUNG JU-YOUNG
IM JINKYU
KIM JI UNG
HUH GEUN
JUNG JU-YOUNG
IM JINKYU
KIM JI UNG
Application Number:
JP2020104514A
Publication Date:
January 28, 2021
Filing Date:
June 17, 2020
Export Citation:
Assignee:
ROHM & HAAS ELECTRONIC MAT KOREA LTD
International Classes:
G03F7/027; C08F2/44; C08F2/50; C08F291/00; G03F7/004; G03F7/023; G03F7/038; G03F7/075
Attorney, Agent or Firm:
Patent Business Corporation Sender International Patent Office