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Title:
POSITIVE TYPE RADIATION SENSITIVE RESIST COMPOSITION AND PRODUCTION OF RESIST PATTERN USING THE COMPOSITION
Document Type and Number:
Japanese Patent JP2000352823
Kind Code:
A
Abstract:

To form a high definition pattern by incorporating an alkali-soluble resin, a compound whose solubility in an aqueous alkali solution is increased by the action of radiation and a compound which forms an alkali-soluble group under a base.

The positive type radiation sensitive resist composition contains an alkali-soluble resin, a compound whose solubility in an aqueous alkali solution is increased by the action of radiation and one or more compounds which are decomposed by the action of a base and form an alkali-soluble group as principal components. The alkali-soluble group is not limited if it increases solubility in the aqueous alkali solution as a developing solution and the group is preferably a carboxyl group or a phenolic hydroxyl group. In the exposed part into which the aqueous alkali solution penetrates rapidly, the decomposition of the compounds and solubilization proceed rapidly and the velocity of dissolution increases.


Inventors:
NIO HIROYUKI
TAMURA KAZUTAKA
Application Number:
JP16682399A
Publication Date:
December 19, 2000
Filing Date:
June 14, 1999
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
H01L21/027; G03F1/68; G03F1/80; G03F7/022; G03F7/023; G03F7/039; (IPC1-7): G03F7/039; G03F1/08; G03F7/022; G03F7/023; H01L21/027