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Patent Searching and Data


Title:
POSITIVE TYPE RESIST COMPOSITION AND PATTERNING METHOD
Document Type and Number:
Japanese Patent JP2002196494
Kind Code:
A
Abstract:

To provide a positive type resist composition which is excellent in sensitivity, dry etching resistance, heat resistance, and has an analog characteristic of varying processing depths on exposure amount, and to provide a pattering method using the same.

The positive type resist composition (I) comprises (A) a vinyl copolymer containing an alkoxysilane group and (C) a curing catalyst. The positive type resist composition (II) comprises (A) a vinyl copolymer containing an alkoxysilane group, (B) a hydrolytic alkoxysilane or its low condensate, and (C) a curing catalyst. The patterning method uses the positive type resist composition (I) or the positive type resist composition (II).


Inventors:
INOUE HIROSHI
MATSUKAWA KOYO
TAMAI SATOYUKI
MATSUURA YUKITO
HAMAMOTO TETSUYA
TOYODA HIROSHI
Application Number:
JP2000396890A
Publication Date:
July 12, 2002
Filing Date:
December 27, 2000
Export Citation:
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Assignee:
JAPAN SCIENCE & TECH CORP
INOUE HIROSHI
MATSUKAWA KOYO
TAMAI SATOYUKI
MATSUURA YUKITO
International Classes:
G03F7/039; C08F230/08; C08K3/00; C08K5/00; C08L43/04; G03F7/075; H01L21/027; (IPC1-7): G03F7/039; C08F230/08; C08K3/00; C08K5/00; C08L43/04; G03F7/075
Attorney, Agent or Firm:
Eiji Saegusa