Title:
後清浄化処理
Document Type and Number:
Japanese Patent JP3850039
Kind Code:
B2
Abstract:
A composition for removal of chemical residues from metal or dielectric surfaces or for chemical mechanical polishing of a copper surface is an aqueous solution with a pH between about 3.5 and about 7. The composition contains a monofunctional, difunctional or trifunctional organic acid and a buffering amount of a quaternary amine, ammonium hydroxide, hydroxylamine, hydroxylamine salt, hydrazine or hydrazine salt base. A method in accordance with the invention for removal of chemical residues from a metal or dielectric surface comprises contacting the metal or dielectric surface with the above composition for a time sufficient to remove the chemical residues. A method in accordance with the invention for chemical mechanical polishing of a copper surface comprises applying the above composition to the copper surface, and polishing the surface in the presence of the composition.
More Like This:
Inventors:
Small, Robert Jay.
Application Number:
JP53593698A
Publication Date:
November 29, 2006
Filing Date:
February 14, 1998
Export Citation:
Assignee:
EK Technology, Incorporated
Small Robert Jay
Small Robert Jay
International Classes:
C11D7/26; B08B3/08; B24B37/04; C09D9/00; C11D3/30; C11D3/43; C11D7/06; C11D7/32; C11D7/50; C11D11/00; C23F3/06; C23G1/00; C23G1/10; C23G1/20; G03F7/42; H01L21/02; H01L21/304; H01L21/308; H01L21/3105; H01L21/321; H01L21/3213; C11D7/34; H01L21/306
Domestic Patent References:
| JP9296200A | ||||
| JP6116756A | ||||
| JP2000501771A | ||||
| JP4213164B1 | ||||
| JP5943884A | ||||
| JP5319308A | ||||
| JP4289866A | ||||
| JP6266119A |
Attorney, Agent or Firm:
Junko Kobayashi
Eiji Katayama
Eiji Katayama