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Patent Searching and Data


Title:
POTTING COMPOUND AND HOLLOW YARN MEMBRANE MODULE
Document Type and Number:
Japanese Patent JPH09220447
Kind Code:
A
Abstract:

To improve the adhesive strength of a porous membrane and the potting workability by composing a potting compound of a bisphenol type epoxy resin, a diglycidyl ether expressed by a specific formula and a polyamine-based hardening agent.

The opening end part of the porous hollow yarn membrane is potted into a module case and is joined and fixed by using the potting compount composed of the bisphenol type epoxy resin, the diglycidyl ether expressed by the formula (R expresses hydrogen or methyl group and (n) expresses integers of 1-20) and the polyamine-based hardening agent. As the bisphenol type epoxy resin of the blending component of the potting compound, a reaction product of a bisphenol with a epichlorohydrine is used. As the bisphenol, bisphenol A obtained by the condensation with aceton, bisphenol F obtained by the condensation with formaldehyde, bisphenol S obtained by the condensation with sulfuric acid, hydrogenated bisphenol A and the like are exemplified.


Inventors:
WATARI KENJI
CHIGA MITSUO
TAKEDA SATORU
KOBAYASHI MASUMI
Application Number:
JP4846496A
Publication Date:
August 26, 1997
Filing Date:
February 13, 1996
Export Citation:
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Assignee:
MITSUBISHI RAYON CO
International Classes:
B01D63/02; C08G59/04; C08G59/06; C09J163/00; (IPC1-7): B01D63/02; C09J163/00
Attorney, Agent or Firm:
Taketoshi Tamura