To provide a powdered resin supply apparatus for semiconductor sealing, in which powdered resin is automatically supplied uniformly or in a desired distribution.

A fast pulley 1 fixed on a substrate side, a movable pulley 2 that can rotate around an axis slidable in a horizontal direction, a belt 3 disposed between the fast pulley 1 and the movable pulley 2, a motor 4 for driving the movable pulley 2, a spring 5 for urging the movable pulley 2, and a square frame 6 are provided. Powered resin 7 is spread in the square frame 6 brought into contact with an upper face of the belt 3 in advance, to be uniform or be in a desired distribution. When the motor 4 is operated to rotate the movable pulley 2, the movable pulley moves in a lateral direction while winding the belt 3 thereon. The powdered resin 7 sequentially drops in a resin mold 30 to be transferred according to the distribution on the belt 3 as the powdered resin has been spread in advance.