Title:
POWDERY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2006063192
Kind Code:
A
Abstract:
To provide a powdery resin composition which is used for sealing semiconductors, and gives high adhesiveness, low moisture adsorption, excellent loading reliability, and low discoloration between the resin and substrates.
This powdery resin composition is characterized by containing a component (A): an episulfide resin produced from a compound having one or more episulfide groups in the molecule and a component (B): an acid anhydride as essential components.
Inventors:
NAKASUJI IKUO
YAMAMOTO TAKAYUKI
TOYAMA TAKASHI
KIYOUGAKU MASAYUKI
YAMAMOTO TAKAYUKI
TOYAMA TAKASHI
KIYOUGAKU MASAYUKI
Application Number:
JP2004247384A
Publication Date:
March 09, 2006
Filing Date:
August 26, 2004
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08G75/08; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Toshio Nishizawa
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