Title:
POWER ASSEMBLY WITH INTEGRATED CURRENT SENSING
Document Type and Number:
Japanese Patent JP3453115
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a power assembly using current sensing technology to solve the limitation of a sensing current and a problem such as cost.
SOLUTION: A semiconductor module has an electrically conductive heat sink base plate with a power semiconductor and printed circuit board. The printed circuit board mounted on the heat sink has a control circuit for the power semiconductor. A rigid L-typed electrode, connected to an electrode of the power semiconductor, is fitted to the base and extends upward adjacent to the edge of the printed circuit board. A Hall sensor mounted on the printed circuit board is positioned in a magnetic field created by a current in the electrode to capture the magnetic field. Magnetic substances fitted to both sides of a Hall element cause the magnetic field that pass the Hall sensor to concentrate.
Inventors:
Agit Debashi
Shayne Maloyan
Joshua Pollack
Shayne Maloyan
Joshua Pollack
Application Number:
JP2000281857A
Publication Date:
October 06, 2003
Filing Date:
September 18, 2000
Export Citation:
Assignee:
INTERNATIONAL RECTIFIER CORPORATION
International Classes:
G01R15/20; (IPC1-7): G01R15/20
Domestic Patent References:
| JP10144863A | ||||
| JP6197574A |
Attorney, Agent or Firm:
Aoyama Ryo (1 person outside)
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