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Title:
POWER CONVERSION DEVICE
Document Type and Number:
Japanese Patent JP2015211600
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a power conversion device which can achieve downsizing and cost reduction of the power conversion device and which can improve vibration resistance of a control substrate.SOLUTION: A power conversion device includes a semiconductor module, a cooler for cooling the semiconductor module, a control substrate connected with the semiconductor module, a terminal for connecting the semiconductor module and the control substrate, and a bus bar for connecting the semiconductor module with an input terminal and an output terminal, in which at least one of a C-plane, S-plane and a lateral face is made to contact a reinforcement member and be fixed to the reinforcement member.

Inventors:
SAKAI SHOJI
Application Number:
JP2014093236A
Publication Date:
November 24, 2015
Filing Date:
April 29, 2014
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H02M7/48
Domestic Patent References:
JPS63279584A1988-11-16
JP2013021855A2013-01-31
JP2010104135A2010-05-06
JP2010041809A2010-02-18
JP2012200071A2012-10-18
JP2013017335A2013-01-24
JP2012204715A2012-10-22
JP2002204580A2002-07-19
JP2009105178A2009-05-14
JP2009201257A2009-09-03
Attorney, Agent or Firm:
Masuo Oiwa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa



 
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