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Title:
POWER CONVERSION DEVICE
Document Type and Number:
Japanese Patent JP2019187105
Kind Code:
A
Abstract:
To provide a power conversion device which can suppress a reduction of a conversion efficiency due to an increase of an ambient temperature of the power conversion device and which can reduce a temperature stress of a semiconductor element.SOLUTION: In a power conversion device 100 having a cooler 103 cooling a semiconductor element 102 within the power conversion device, the cooler 103 enhances cooling capacity and lowers an element temperature by a cooler driving system 110a when an outside air temperature is high, thereby increasing a power conversion efficiency of the power conversion device 100.SELECTED DRAWING: Figure 1

Inventors:
GOTO KENGO
ITO TOMOMICHI
Application Number:
JP2018075829A
Publication Date:
October 24, 2019
Filing Date:
April 11, 2018
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H02M7/48; H01L23/36; H05K7/20
Attorney, Agent or Firm:
Yuji Toda



 
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