To provide low-cost piece of power conversion equipment which enables the connection of a semiconductor unit with an electronic component unit to easily and surely be performed.

The power conversion equipment 1 includes the semiconductor unit 2 and the electronic component unit 3. The semiconductor unit 2 includes a semiconductor module 21 and a semiconductor side bus bar 22 while the electronic component unit 3 includes a constituent electronic component 31 and an electronic component side bus bar 35. The power conversion equipment 1 includes bolts 41, nuts 42 and nut accommodation part 34. The nut accommodation part 34 includes a nut accommodation bottom 341, a nut accommodation wall 342 and an opening 343. The outer configuration of the inner side surface 344 of the nut accommodation wall 342 is larger than the outer configuration of each of the nuts 42 while having the detent function of each of the nuts 42. The electronic component side bus bar 35 is disposed to cover the opening 343 of the nut accommodation part 34 that accommodates the nuts 42.