To provide a power converter that can be miniaturized.
The power converter includes: a semiconductor element (10) that has a switching element (11) and a rectification element (12); a cooling member (37) that cools the semiconductor element (10); and packaging members (28, 36, 32) that are interposed between the semiconductor element (10) and the cooling member (37) and achieve coupling of both of them and mutual heat transfer. The packaging members include at least two filling members (33, 34) with different thermal conductivities from each other. The filling member (34) with a relatively high thermal conductivity of the filling members (33, 34) is disposed between the switching element (11) and the cooling member (37), while the filling member (33) with a relatively low thermal conductivity is disposed between the rectification element (12) and the cooling member (37).
SHISHIDO KEIKO
MORIKAWA KUNIHIKO
Masahiro Fujii
Yasunari Mita
Masaaki Iida