To enable good joining of a joining surface having a large area while preventing the damage of an insulation substrate thereby enabling a power module to achieve good heat radiation performance in a structure where a lead and a substrate wiring pattern are joined to each other through ultrasonic joining in the power module.
A power module includes: a substrate where multiple wiring patterns are formed on a surface; semiconductor elements electrically connecting with some of the wiring patterns among the multiple wiring patterns mounted on the substrate; and a terminal part having leads electrically connecting with the other wiring patterns among the multiple wiring patterns. In the power module, each lead of the terminal part is formed by laminating multiple metal members including a material which is equivalent to or softer than a material of the other wiring patterns. The material, which is equivalent to or softer than the other wiring patterns among the multiple metal members, is electrically connected with the other wiring patterns through ultrasonic joining.
HIYOSHI MICHIAKI
YOKOZUKA TAKEHIDE
MURAMOTO AKIHIRO
| JP2011159780A | 2011-08-18 | |||
| JP2009038139A | 2009-02-19 |
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