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Title:
POWER MODULE AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2013051366
Kind Code:
A
Abstract:

To enable good joining of a joining surface having a large area while preventing the damage of an insulation substrate thereby enabling a power module to achieve good heat radiation performance in a structure where a lead and a substrate wiring pattern are joined to each other through ultrasonic joining in the power module.

A power module includes: a substrate where multiple wiring patterns are formed on a surface; semiconductor elements electrically connecting with some of the wiring patterns among the multiple wiring patterns mounted on the substrate; and a terminal part having leads electrically connecting with the other wiring patterns among the multiple wiring patterns. In the power module, each lead of the terminal part is formed by laminating multiple metal members including a material which is equivalent to or softer than a material of the other wiring patterns. The material, which is equivalent to or softer than the other wiring patterns among the multiple metal members, is electrically connected with the other wiring patterns through ultrasonic joining.


Inventors:
YOSHIDA ISAMU
HIYOSHI MICHIAKI
YOKOZUKA TAKEHIDE
MURAMOTO AKIHIRO
Application Number:
JP2011189574A
Publication Date:
March 14, 2013
Filing Date:
August 31, 2011
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H01L25/07; B23K20/00; B23K20/10; H01L21/60; H01L21/607; H01L25/18
Domestic Patent References:
JP2011159780A2011-08-18
JP2009038139A2009-02-19
Attorney, Agent or Firm:
Polaire Patent Business Corporation