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Title:
POWER MODULE AND MANUFACTURING METHOD FOR THE SAME, AND POWER CONVERTER
Document Type and Number:
Japanese Patent JP2018195724
Kind Code:
A
Abstract:
To provide a power module which can achieve further improved reliability; and provide a manufacturing method for the power module; and provide a power converter.SOLUTION: A power module 1 comprises an insulating circuit board 7 and a power semiconductor element 13. The power semiconductor element 13 includes an element body 13a, a surface electrode 13b and a back electrode 13c. The insulating circuit board 7 includes an insulating substrate 7a, circuit patterns 7b, 7c and a conductive member 7d. The power semiconductor element 13 and the insulating circuit board 7 are jointed by a second joint part 5b which forms a planar joint surface 5. In the second junction part 5d, a joint material 9 prevails in a planar state and partitioning members 11 are arranged so as to partition the joint material 9 in a plan view. The partitioning members 11 are formed by a material different from that of the joint material 9.SELECTED DRAWING: Figure 2

Inventors:
FUKUMOTO AKIHISA
YOKOYAMA YOSHINORI
TANAKA YO
Application Number:
JP2017098867A
Publication Date:
December 06, 2018
Filing Date:
May 18, 2017
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L25/07; H01L21/52; H01L21/60; H01L23/28; H01L25/18; H02M7/48
Domestic Patent References:
JPS59186332A1984-10-23
JP2006041362A2006-02-09
JP2008118010A2008-05-22
JP2011192695A2011-09-29
JP2011238779A2011-11-24
Attorney, Agent or Firm:
Fukami patent office