Title:
パワーモジュール
Document Type and Number:
Japanese Patent JP4044265
Kind Code:
B2
Abstract:
A power module includes a first substrate with a power semiconductor device mounted thereon, a second substrate with a control circuit for controlling the power semiconductor device formed thereon, a smoothing capacitor electrically connected to the power semiconductor device for smoothing a voltage to be externally supplied to the power semiconductor device, and a case including a case frame and a case lid. The case has an interior in which the first substrate, the second substrate and the smoothing capacitor are disposed, and the smoothing capacitor is disposed in contact with a side surface of the case frame.
Inventors:
Nobuyoshi Kimoto
Yoshinobu Yoshida
Naoki Yoshimatsu
Manjuo Koga
Yasushi Nakajima
Majmudar go love
Fukada Masakazu
Yoshinobu Yoshida
Naoki Yoshimatsu
Manjuo Koga
Yasushi Nakajima
Majmudar go love
Fukada Masakazu
Application Number:
JP2000143482A
Publication Date:
February 06, 2008
Filing Date:
May 16, 2000
Export Citation:
Assignee:
Mitsubishi Electric Corporation
Renesas Semiconductor Engineering Co., Ltd.
Renesas Semiconductor Engineering Co., Ltd.
International Classes:
H01L25/00; H01L23/057; H01L23/50; H01L23/60; H01L25/07; H01L25/18; H02M1/00; H02M7/00; H02M7/04
Domestic Patent References:
| JP2000060138A | ||||
| JP9186269A | ||||
| JP8289567A | ||||
| JP11018429A | ||||
| JP2000091767A | ||||
| JP2000092847A | ||||
| JP6123449A | ||||
| JP2000014169A |
Foreign References:
| WO1999021228A1 |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita