To provide a MEMS (micro electromechanical system) switch capable of being operated by high input/output current, and interconnecting method and packaging method applicable to a MEMS relay.
A MEMS structural body is provided which is further equipped with a MEMS device (240) having a first surface having one or a plurality of contact structures (244, 245, 246) thereon and bonded to its own functional element, a dielectric layer (100) to cover the first surface in which an opening to expose these contact structures (244, 245, 246) is demarcated inside thereof, patterned metallized layers (254, 255, 256) containing a conductive material extending from the contact structures (244, 245, 246) to the surface of this dielectric layer through the opening in the dielectric layer (100), and a first heat sink (190) thermally communicated with these metallized layers (254, 255, 256).
ELASSER AHMED
WRIGHT JOSHUA ISAAC
SUBRAMANIAN KANAKASABAPATHI
KEIMEL CHRISTOPHER FRED
GOWDA ARUN VIRUPAKSHA
Hirokazu Ogura
Toshihisa Kurokawa
Arakawa Satoshi