Title:
パワー半導体装置及びその製造方法並びに電力変換装置
Document Type and Number:
Japanese Patent JP7286016
Kind Code:
B2
Abstract:
A power semiconductor apparatus includes a conductive circuit pattern, a power semiconductor device, a sealing member, a conductive post, and a conductive post. A first conductive post is connected to the conductive circuit pattern. A second conductive post is connected to the power semiconductor device. The first conductive post includes a metal pin and a conductive bonding member. The conductive post includes a metal pin and a conductive bonding member.
Inventors:
Tatsushi Morisada
Application Number:
JP2022528375A
Publication Date:
June 02, 2023
Filing Date:
June 05, 2020
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/48; H01L25/07; H01L25/18
Domestic Patent References:
| JP201021338A | ||||
| JP2013102112A | ||||
| JP20124226A | ||||
| JP201027813A | ||||
| JP201692233A | ||||
| JP2019110284A |
Foreign References:
| WO2012011210A1 |
Attorney, Agent or Firm:
Patent Attorney Fukami Patent Office
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