Title:
POWER SUPPLY DEVICE BURYING STRUCTURE AND POWER SUPPLY DEVICE BURYING METHOD
Document Type and Number:
Japanese Patent JP2023166788
Kind Code:
A
Abstract:
To bury a power supply device for contactlessly supplying power to a power reception device provided on a movable body in the vicinity of a road surface of a driving lane having asphalt pavement by achieving high workability and adhesiveness.SOLUTION: In a power supply device burying structure, a power supply device for contactlessly supplying power to a power reception device provided on a movable body moving on a driving lane is buried in the driving lane. The power supply device has a power supply coil and a coil case to store the power supply coil and is formed by burying the coil case in a pavement of the driving lane constructed by curing asphalt mixture. Intermediate members for forming a rough surface are provided on a surface of the coil case.SELECTED DRAWING: Figure 1
Inventors:
KUBOTA TAKAYUKI
TANAKA KOICHI
KAWAKAMI YOSHIHIRO
TANAKA KOICHI
KAWAKAMI YOSHIHIRO
Application Number:
JP2022077568A
Publication Date:
November 22, 2023
Filing Date:
May 10, 2022
Export Citation:
Assignee:
OHBAYASHI CORP
International Classes:
E01C7/00
Attorney, Agent or Firm:
Patent Attorney Corporation Isshiki International Patent Office
Previous Patent: JPWO2023166787
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