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Title:
POWER SUPPLY WIRING STRUCTURE
Document Type and Number:
Japanese Patent JP2014053570
Kind Code:
A
Abstract:

To make a voltage drop in each internal circuit in power supply wiring uniform and to make a power supply voltage supplied to each internal circuit uniform.

In a power supply wiring structure of a semiconductor integrated circuit having power supply wiring for supplying power from the outside to each of a plurality of internal circuits formed in the semiconductor integrated circuit, the power supply wiring includes a plurality of feeding points obtained by successively branching one end of the power supply wiring, so that each of the feeding point becomes a feeding point to a load being the internal circuit. Also, the other end of the power supply wiring becomes a power receiving point of the semiconductor integrated circuit. A circuit that consumes power is not connected between the power receiving point and the feeding point.


Inventors:
MORISHIGE TOMOHARU
Application Number:
JP2012198851A
Publication Date:
March 20, 2014
Filing Date:
September 10, 2012
Export Citation:
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Assignee:
HITACHI INFO & TELECOMM ENG
International Classes:
H01L21/82; H01L21/3205; H01L21/768; H01L21/822; H01L23/522; H01L27/04
Attorney, Agent or Firm:
Patent Business Corporation Takewa International Patent Office