Title:
PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2017193614
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a prepreg capable of reducing the amount of warpage of a semiconductor package due to a temperature change even when the thickness of a printed wiring board is small.SOLUTION: The prepreg includes a reinforcing fiber substrate and a semi-cured product of a resin composition impregnated into the reinforcing fiber substrate. The prepreg has a glass transition temperature (Tg) of 220°C or lower and an elastic modulus at 260°C of 10 GPa or less after curing. The resin composition contains (A) an epoxy resin, (B) a phenolic resin, (C) a low elastic component, and (D) an inorganic filler. The component (A) has an epoxy equivalent of 180 g/eq or more. The component (B) has a hydroxyl equivalent of 180 g/eq or more. The content of the component (D) is 130 pts.mass or less based on 100 pts.mass of the total of the components (A) and (B).SELECTED DRAWING: None
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Inventors:
OBATA SHINPEI
TAKAHASHI RYUJI
FUJITA SHIGETOSHI
HOSHINO YASUNORI
TAKAHASHI RYUJI
FUJITA SHIGETOSHI
HOSHINO YASUNORI
Application Number:
JP2016084032A
Publication Date:
October 26, 2017
Filing Date:
April 19, 2016
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
C08J5/24; B32B15/08; B32B15/092; B32B15/098; B32B17/04; B32B27/20; B32B27/38; B32B27/42; H05K1/03
Domestic Patent References:
| JP2014193994A | 2014-10-09 | |||
| JP2015063040A | 2015-04-09 |
Foreign References:
| US20160090457A1 | 2016-03-31 |
Attorney, Agent or Firm:
Patent business corporation Hokuto patent office
Keisei Nishikawa
Mizuhiji Katsuhisa
Yoshishige Takeo
Keisei Nishikawa
Mizuhiji Katsuhisa
Yoshishige Takeo