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Title:
PRE-TREATMENT OF ELECTROLESS PLATING
Document Type and Number:
Japanese Patent JP2003064479
Kind Code:
A
Abstract:

To improve the selectivity of electroless plating by removing negative charge on the surface of an insulating film of a substrate.

A pre-treatment of electroless plating for forming a plating film on the substrate 51 by electroless plating is carried out to remove negative charge on the surface of the substrate 51 by applying AC power from an AC power source 18 on the surface of the substrate 51 opposite from the surface on which the plating film of the substrate 51 is formed by dipping the substrate 51 into an electrolyte 41. As the pre-treatment, the negative charge on the surface of the substrate 51 may be removed by applying DC bias power while applying AC power or may be removed while applying pulse power.


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Inventors:
KITO HIDEYOSHI
NOGAMI TAKESHI
TAGUCHI MITSURU
KOMAI HISANORI
Application Number:
JP2001250962A
Publication Date:
March 05, 2003
Filing Date:
August 22, 2001
Export Citation:
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Assignee:
SONY CORP
International Classes:
C23C18/18; C23C18/16; H01L21/288; H01L21/3205; H01L23/52; (IPC1-7): C23C18/18; C23C18/16; H01L21/288; H01L21/3205
Domestic Patent References:
JPS63111179A1988-05-16
JP2000096252A2000-04-04
JPH07180080A1995-07-18
Attorney, Agent or Firm:
Kuninori Funabashi



 
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