Title:
貴金属の回収方法及び回収装置
Document Type and Number:
Japanese Patent JP6789757
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a recovery method of noble metal from a substrate covered by the noble metal, capable of conducting operations effectively without touch to a substrate to which an agent liquid is attached or the agent liquid by an operator.SOLUTION: A method has a dissolution treatment process S1 for charging a substrate covered by a covering material of a noble metal into a double structured container together with a dissolution liquid of the amount with which whole substrate can be impregnated, rotating an inner part thereof normally and reversely alternatively at low speed and dissolving the covering material, a dissolution liquid recovery process S2 for recovering the dissolution liquid after the dissolution treatment process S1, then rotating the inner part at high speed and recovering the dissolution liquid adhered to the substrate, a cleaning treatment process S3 for supplying a cleaning liquid to the container after the dissolution liquid recovery process S2, rotating an inner part thereof normally and reversely alternatively at low speed and cleaning the substrate, and a cleaning liquid recovery process S4 for recovering a cleaning drainage generated in the cleaning treatment process S3 separately, then rotating the inner part at high speed and recovering the cleaning drainage adhered to the substrate.SELECTED DRAWING: Figure 2
Inventors:
Suohara Ken
Kazuya Maeba
Kazuya Maeba
Application Number:
JP2016208369A
Publication Date:
November 25, 2020
Filing Date:
October 25, 2016
Export Citation:
Assignee:
Oguchi Electronics Co., Ltd.
International Classes:
C22B11/00; C22B3/04; C22B7/00
Domestic Patent References:
| JP52082234A | ||||
| JP61008092A |
Attorney, Agent or Firm:
Noriyuki Tsujikawa