PURPOSE: To provide a small-sized precision cutting apparatus wherein even a large-diameter wafer can be cut at a small cutting stroke.

CONSTITUTION: This apparatus includes a table movement means which moves a chuck table 1 to a cutting direction and a spindle movement means which moves a spindle unit 4 to the cutting direction. The chuck table 1 and the spindle unit 4 are formed so as to cut a wafer 2 by being moved in a direction in which they are brought close to each other and in a direction in which they are separated from each other.