Title:
PRECONDITIONER FOR POLISHING PAD AND ITS USAGE
Document Type and Number:
Japanese Patent JP3702023
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To reuse a preconditioning plate for preparing a polishing pad used for flattening a semiconductor substrate and to reduce the cycle time for the preconditioning.
SOLUTION: A preconditioning plate 10 prepares and adjusts the surface of a polishing pad 24 for preparing a pad surface for subsequent metal polishing of a semiconductor wafer 27. The preconditioning plate is provided with at least three intersecting radial ridges 14 on its surface and formed of a rigid plastic material. The preconditioning plate is rotated relative to the surface of the polishing pad prior to practical polishing to provide the uniform and stable polishing face.
Inventors:
James Michael Mullins
Application Number:
JP2994596A
Publication Date:
October 05, 2005
Filing Date:
January 24, 1996
Export Citation:
Assignee:
Freescale Semiconductor, Inc.
International Classes:
B24B53/00; B24B53/007; B24B53/017; H01L21/304; (IPC1-7): B24B37/00; B24B53/00; H01L21/304
Domestic Patent References:
| JP6226628A | ||||
| JP2065966A | ||||
| JP5104440A | ||||
| JP1171762A | ||||
| JP6075655U | ||||
| JP3093069U |
Attorney, Agent or Firm:
Yoshiaki Ikeuchi
Mamoru Kuwagaki
Mamoru Kuwagaki