Title:
前駆体組成物、感光性樹脂組成物、前駆体組成物の製造方法、硬化膜、硬化膜の製造方法および半導体デバイス
Document Type and Number:
Japanese Patent JP6612343
Kind Code:
B2
Abstract:
Provided are photosensitive resin compositions having a wide exposure latitude, a precursor composition for providing such a photosensitive resin composition, a method for producing a precursor composition, a cured film, a method for producing a cured film; and a semiconductor device. The precursor composition is a precursor composition containing at least one kind of heterocycle-containing polymer precursor, in which the heterocycle-containing polymer precursor is selected from a polyimide precursor and a polybenzoxazole precursor; and the dispersity which is a weight-average molecular weight/a number-average molecular weight of the heterocycle-containing polymer precursor is 2.5 or more.
Inventors:
Akinori Shibuya
Yu Iwai
Takeshi Kawabata
Ichiro Koyama
Yu Iwai
Takeshi Kawabata
Ichiro Koyama
Application Number:
JP2017526399A
Publication Date:
November 27, 2019
Filing Date:
June 29, 2016
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
C08F290/14; G03F7/027; C08G73/06; G03F7/023
Domestic Patent References:
| JP9059379A | ||||
| JP2009258433A | ||||
| JP2009175358A | ||||
| JP2002122991A | ||||
| JP2004155911A | ||||
| JP11310769A |
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes