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Patent Searching and Data


Title:
PREPARATION OF ACRYLIC SHEET MOLDING COMPOUND
Document Type and Number:
Japanese Patent JP2001040104
Kind Code:
A
Abstract:

To obtain a thin acrylic sheet molding compound having good film releasability and handleability.

This preparation process comprises applying, on two sheets of release films, an acrylic resin composition (X) comprising the constituent components of an acrylic monomer or acrylic syrup (A), an inorganic filler (B), and the powdery acrylic polymer (C) with an weight-average molecular weight of 50,000 or more, thereafter adding a fiber reinforcing agent (Y) onto the acrylic resin composition (X)-applied surface of one of the two films, placing thereon the another film with facing to the surface applied with the acrylic resin composition (X), and then impregnating the acrylic resin composition (X) into the fiber reinforcing agent (Y) to thereby make it thicken.


Inventors:
KOYANAGI SEIYA
YONEKURA KATSUMI
KISHIMOTO YUICHIRO
YANASE AKEMASA
Application Number:
JP21894299A
Publication Date:
February 13, 2001
Filing Date:
August 02, 1999
Export Citation:
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Assignee:
MITSUBISHI RAYON CO
International Classes:
C08J5/04; C08K3/00; C08K7/02; C08K13/04; C08L33/02; (IPC1-7): C08J5/04; C08K3/00; C08K7/02; C08K13/04; C08L33/02