Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PREPARATION OF ALUMINUM-CORED COPPER-CLAD LAMINATED PLATE
Document Type and Number:
Japanese Patent JPS62216727
Kind Code:
A
Abstract:

PURPOSE: To obtain excellent adhesiveness of an insulative resin layer with a copper foil and an aluminum core by etching and roughing the aluminum surface with an acidic aqueous solution containing chlorine ions, by coating thinly the surface with a coupling agent and by heating and pressing a lamination of a specified insulative resin layer and the copper foil with each other.

CONSTITUTION: An aluminum 3 the surface of which has been etched and roughed with an acidic aqueous solution containing chlorine ions are thereafter is being coated thinly with a coupling agent, an insulative resin layer 2 consisting of polyethylene, cross-linked polyethylene or polymethylpentene and a copper foil whose roughed surface is being coated with a coupling agent are put one upon another and heated and pressed. The resin 2 has poor adhesiveness, but by using this method, very strong adhesion between the aluminum plate 3 and the copper foil 1 can be obtained because of a physical anchor effect and a chemical adhesive effect.


Inventors:
KAMIYA MASAMI
YOKOTA MITSUO
IIJIMA TOSHIYUKI
Application Number:
JP6157586A
Publication Date:
September 24, 1987
Filing Date:
March 19, 1986
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08J5/12; B29C65/02; B32B15/08; B29L9/00; H05K3/38; H05K3/44; (IPC1-7): B29C65/02; B29L9/00; B32B15/08; C08J5/12
Attorney, Agent or Firm:
Hirose Akira