Title:
PREPARATION OF CONDUCTIVE PANEL AND INSULATING BASE MATERIAL
Document Type and Number:
Japanese Patent JPS5456173
Kind Code:
A
Abstract:
Molded laminates useful in the preparation of electrically conductive panels are provided by a method comprising providing an article comprising a metal carrier or support layer, at least one insulating layer and a copper outer layer, the carrier having a plurality of perforations therethrough which are substantially filled with the insulating material, and compressing the layered article to produce a molded laminate. In other embodiments, the method comprises the further steps of forming a hole through at least some of the filled perforations, and, if desired, sensitizing the walls of the holes to electroless metal deposition and depositing a layer of metal thereon. Articles produced by the methods of this invention are also provided.
Inventors:
TEODOORU PABURITSUKU
Application Number:
JP10741178A
Publication Date:
May 04, 1979
Filing Date:
August 30, 1978
Export Citation:
Assignee:
KOLLMORGEN TECH CORP
International Classes:
B32B15/04; B32B5/00; B32B15/08; H05K1/05; H05K3/44; H05K1/03; H05K3/42; (IPC1-7): B32B5/08; B32B15/04; H05K3/00