Title:
PREPARATION OF ELECTRON EMISSION FILAMENT ASSEMBLY AND FILAMENT ASSEMBLY
Document Type and Number:
Japanese Patent JPH06290705
Kind Code:
A
Abstract:
PURPOSE: To provide an electron emitting filament assembly which can highly reliably work at high operation temperature and can be manufactured at high production yield through a lessened number of manufacturing steps and provide a method for manufacturing the assembly at low cost. CONSTITUTION: Parts of a first and a second conductive posts 26, 28 are air tightly fixed in a mold cavity forming a base 70. A molten compound is supplied to the cavity and cured to capsulate and enclose the posts to form a base in the surrounding of the posts. When the electric current applied from the first post 26 reaches the second post 28 through the filament 72, a filament made of a material which can emit electrons in controlled supply amount is selected and the filament is electrically connected between the first post and the second post.
Inventors:
MITSUCHIERU SHII BAAHAMU
JIEIMUZU II SHIYUTAINAA
TOOMASU SHII KURISUTENSEN
JIEIMUZU II SHIYUTAINAA
TOOMASU SHII KURISUTENSEN
Application Number:
JP6755794A
Publication Date:
October 18, 1994
Filing Date:
March 11, 1994
Export Citation:
Assignee:
HEWLETT PACKARD CO
International Classes:
H01J1/18; B29C45/14; H01J5/54; H01J9/04; H01J49/08; (IPC1-7): H01J9/02; H01J1/18
Attorney, Agent or Firm:
Endo Kyo
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