PURPOSE: To improve removal of chips and flow of grinding liquid and prolong the service life of a grindstone by applying cosedimentation plating onto a stainless plate, etc. by the plating liquid containing nickel, etc. in which diamond grinding grains and minute organic particles are dispersed and then heat-treating said stainless steel plate at high temperature.

CONSTITUTION: A stainless-steel plate 1 having a thickness of 0.05W0.2mm is cut into a disc free from warp and applied with ground-plating by a nickel chloride bath. Then, said plate is applied with cosedimentation plating by the liquid containing diamond grinding grains 1W10g/l, phenol resin powder 50g/l, nickel sulfamate 340W540g/l, and nickel chloride 10g/l. Then, phenol resin is burned by heating said plate for one hour in a high-temperature furnace at 500°C. After such heat-treatment, pocket chips are formed, at the place where organic particles 4 are burnt, and removal of cutting chips is facilitated, and flow of grinding liquid is made easy, and a grindstone which has the reduced gerinding resistance and a long service life and in which the abrasion of diamond can be reduced, can be obtained.