PURPOSE: To prepare a laminate board free from warpage, by cutting off the excessive resin parts of the laminate board generated to both sides thereof at the time of preheating curing.
CONSTITUTION: A substrate 2 such as paper is immersed in a varnish tank 5 to be impregnated with a thermosetting resin. Subsequently, a required number of the substrates are stacked and passed through a pair of upper and lower squeeze rolls 6 and adhered under pressure to form a laminated base material 3. Next, this laminated base material 3 is preheated by heaters 9 to be subjected to preparatory curing (to a degree not fluidizing the impregnated resin). Then, a metal foil 8 is adhered to this pre-cured base material 3 through a laminate roll 7. Thereafter, tab parts 4, 4 comprising the excessive resin formed to both sides of the base material 3 are cut off by a cutter 13. Finally, the trimmed one is perfectly cured in a heating drying oven 10. The obtained laminated base material becomes uniform in strain and residual stress and generates almost no warpage or twisting.
KUNITOMI TETSUO
HORIBATA SOUICHI
MITOU TETSUO
TAWARA AKIO
| JPS5698136A | 1981-08-07 |
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