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Patent Searching and Data


Title:
PREPARATION METHOD OF POLYIMIDE RESIN
Document Type and Number:
Japanese Patent JP2004189793
Kind Code:
A
Abstract:

To provide a method of preparing a polyimide resin that can industrially advantageously prepare a polyimide resin which has a very high utility value as electric/electronic materials, is excellent in heat resistance and fabricability and has a stable quality without using an organic solvent.

In the preparation method of the polyimide resin, a tetracarboxylic dianhydride and a diamine are kneaded using a kneader without any solvent and reacted through shear heating. Here, the tetracarboxylic dianhydride and the diamine are both in solid states and preferably have average particle sizes of ≤30 μm.


Inventors:
OKADA WATARU
Application Number:
JP2002356786A
Publication Date:
July 08, 2004
Filing Date:
December 09, 2002
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08G73/10; (IPC1-7): C08G73/10