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Patent Searching and Data


Title:
PREPARATION MOLDING DEVICE AND PREPARATION
Document Type and Number:
Japanese Patent JP2003210553
Kind Code:
A
Abstract:

To further improve anticorrosion of parts of a preparation molding device in the molding of the preparation by the compression molding of corrosive materials.

The preparation molding device 1 which performs compression molding of the material a comprising corrosive granules or powders to mold preparation a' comprises the second table 12 on which are formed a hopper 20 for storing the material (a) and a quantitative container 16 for conveying the material (a) stored in the hopper 20 by a fixed amount each, the first table 11 on which is formed a mortar 15 for molding the preparation a', a filling bottle 26 for filling the mortar 15 with the material (a) stored in the hopper 20 by a fixed amount each, pestles 32 and 33 which mold the preparation a' by compressing the material (a) filled into the mortar 15, and a takeoff pin 42 for taking the preparation a' out of the mortar 15. At least one of the hopper 20, the quantitative container 16, the mortar 15, the filling pin 26, the pestles 32 and 33 and the takeoff pin 42 is made of a metal such as Ti or the surface thereof is coated with a diamond-like C or the like.


Inventors:
IKEMATSU YASUYUKI
MORITA YUTAKA
YASUI MASANOBU
TSUSHIMA YUUKI
Application Number:
JP2002329769A
Publication Date:
July 29, 2003
Filing Date:
November 13, 2002
Export Citation:
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Assignee:
EISAI CO LTD
International Classes:
A61J3/10; A61K9/20; A61K31/216; A61K31/439; A61K31/445; A61K31/495; A61K38/55; A61P25/00; B30B11/08; (IPC1-7): A61J3/10; A61K9/20; A61K31/216; A61K31/439; A61K31/445; A61K31/495; A61K38/55; A61P25/00; B30B11/08
Attorney, Agent or Firm:
Koji Hagiwara (2 outside)