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Title:
PREPARATION OF POLYIMIDE FILM
Document Type and Number:
Japanese Patent JPS60244508
Kind Code:
A
Abstract:

PURPOSE: To prepare a polyimide film by a casting method without tearing and injuring the same during release, by casting a polymer solution containing polyamic acid or polyimide to the surface of a metal substrate, which is preliminarily coated with a solvent and heat-treated at 60W250°C, in a film form.

CONSTITUTION: A solvent such as water or methanol is preliminarily applied to a metal plate such as a stainless steel plate and the coated metal plate is heat- treated at 60W250°C, pref., 80W200°C. Subsequently, an aromatic polyamic acid solution composition is filtered and defoamed to be cast onto the metal plate in a uniform thickness and heated to about 60W170°C by hot air or infrared rays to remove the solvent and pre-dried to form a self-supporting film which is, in turn, released from the metal plate. The wt. reduction of the self-supporting film under heating at this time is pref. about 5W40wt%.


Inventors:
SASAKI YOSHIKAZU
INOUE HIROSHI
HIRANO TETSUHARU
Application Number:
JP9881184A
Publication Date:
December 04, 1985
Filing Date:
May 18, 1984
Export Citation:
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Assignee:
UBE INDUSTRIES
International Classes:
C08L79/08; B29C41/12; C08J5/18; B29K79/00; (IPC1-7): B29C41/12; B29K79/00; C08J5/18; C08L79/08
Domestic Patent References:
JPS57109613A1982-07-08