Title:
PREPARATION OF RUBBER PAD FOR RUBBER BUFFER
Document Type and Number:
Japanese Patent JPH04299112
Kind Code:
A
Abstract:
PURPOSE: To form a rubber pad for a rubber buffer having such a form that rubber blocks are fixed to both surfaces of a plate metal fitting by injection molding.
CONSTITUTION: The rubber material from an injection machine is injected in a mold from an injection hole 42 in such a state that a runner plate 20 having a runner 28 therein is set to the mold and the runner 28 is allowed to run to fill the respective cavities 31 of the mold. After the mold is opened, the runner plate 20 is taken out and a plate metal fitting 12 is set and the mold is again closed and the rubber material is vulcanized under pressure and heating to be integrally fixed to the plate metal fitting 21.
Inventors:
NAKANISHI IKUO
Application Number:
JP9130091A
Publication Date:
October 22, 1992
Filing Date:
March 28, 1991
Export Citation:
Assignee:
TOKAI RUBBER IND LTD
International Classes:
B29C45/14; B29C45/00; B29C45/26; B29C45/33; B29K21/00; B29K105/22; (IPC1-7): B29C45/14; B29C45/26; B29C45/33; B29K21/00; B29K105/22
Attorney, Agent or Firm:
Kazuo Yoshida