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Patent Searching and Data


Title:
PREPARATION OF SANDWICH-STRUCTURAL PANEL
Document Type and Number:
Japanese Patent JPH04173331
Kind Code:
A
Abstract:

PURPOSE: To obtain a sandwich-structural panel within a short time by simple bonding work using a specific one-pack type moisture-curable urethane adhesive in the bonding of surface materials and a core material.

CONSTITUTION: In preparing a sandwich-structural panel by using a weighed base material as a core material and bonding surface plates to the core material, an one- pack type moisture-curable urethane adhesive containing 0.1-6wt.% of isocyanate as the solid conversion value of an entire adhesive also compounded with various additives, having a mean MW of 8000-50000 and showing heat activity at 70°C or higher is applied to the single surfaces of the surface plates and the surface plates are pressed to the core material for several sec by a heating press and for several sec by a cooling press to be bonded thereto. When a prepolymer whose mean MW is less than 8000-50000 is applied, it runs off without being sufficiently bonded and, when the prepolymer whose mean MW is more than 8000-50000 is applied, coating workability is bad because of high solution viscosity and low solid content. When isocyanate content is less than 1-6wt.% as the solid conversion value in the entire adhesive, sufficient crosslinking curing is not performed and, when said content is larger than 1-6wt.%, sufficient curing is not performed only by the moisture in the base material.


Inventors:
HASEGAWA SHIN
FUKUDA JIRO
Application Number:
JP30162990A
Publication Date:
June 22, 1992
Filing Date:
November 07, 1990
Export Citation:
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Assignee:
AICA KOGYO CO LTD
International Classes:
C08J5/12; B32B7/12; B32B37/10; (IPC1-7): B32B7/12; B32B31/20; C08J5/12