Title:
PREPARATION OF THERMOSETTING RESIN MOLDING MATERIAL
Document Type and Number:
Japanese Patent JPS5813634
Kind Code:
A
Abstract:
PURPOSE: To prepare the titled fine resin powder which can be used without pulverization, by heating a resin syrup sprayed under reduced pressure, thereby dehydrating the produced polycondensate.
CONSTITUTION: For example, the resin syrup 1 such as urea resin etc. in the syrup tank 2 is preheated with the preheater 5, sent to the spray dehydrator 4 kept to reduced pressure by the vacuum pump 6, and sprayed through the nozzle 7 and at the same time heated with the heater 8 to effect the dehydration of the produced polycondensate. The polycondensate collected to the bottom of the dehydrator 4 is taken out through the outlet 9 such as rotary valve, etc. as resin powder 13. The heater 8 is preferably an infrared lamp, etc.
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Inventors:
ISHIKAWA GENICHI
TAKATSUKA TOMIO
TAKATSUKA TOMIO
Application Number:
JP11121281A
Publication Date:
January 26, 1983
Filing Date:
July 15, 1981
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08J3/12; (IPC1-7): C08J3/12
Attorney, Agent or Firm:
Ishida Choshichi
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