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Title:
PREPARATION OF THERMOSETTING SOLID RESIN
Document Type and Number:
Japanese Patent JPS5230891
Kind Code:
A
Abstract:

PURPOSE: To prepare a thermosetting solid resin containing an N-alkoxymethyl (meth)acrylamide as an essential copolymerization component.


Inventors:
SAMORI TAKASHI
MATSUSHIMA KOUJI
TANAKA SUSUMU
Application Number:
JP10726075A
Publication Date:
March 08, 1977
Filing Date:
September 04, 1975
Export Citation:
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Assignee:
MITSUBISHI RAYON CO
International Classes:
C08F6/00; C08F6/06; C08F6/22; C08F20/00; C08F20/52; C08F220/58; C08F246/00; C08L33/04; C09D5/03; (IPC1-7): C08F6/22; C08F220/58; C08F246/00; C08L33/04; C09D3/727
Domestic Patent References:
JP46017121A
JPS4811815A
JPS4873196A1973-10-02



 
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