PREPARATION OF UNIT THERMAL HEAD IN SPLIT/CONNECTION TYPE THERMAL HEAD

Title:

PREPARATION OF UNIT THERMAL HEAD IN SPLIT/CONNECTION TYPE THERMAL HEAD

Document Type and Number:

Japanese Patent JPH0542699

Kind Code:

A

Abstract:

PURPOSE: To reduce the generation rate of chipping such as breakage in the protective film on the cut surface of a unit thermal head or the protective film and a heat accumulation layer when the unit thermal head is formed by cutting a thermal head material having appropriate length along a cutting line.

CONSTITUTION: When a heat accumulation layer 12 is formed to the upper surface of the insulating substrate 11 of a thermal head material and a protective film 16 is formed to the upper surface of the heat accumulation layer 12, the protective film 16 or the protective film 16 and the heat accumulation layer 12 is formed so that the laterial dimension thereof is made partially narrow at the place of each cutting line C of the thermal head material.

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Inventors:

OTA SHIGEO
TAGASHIRA FUMIAKI
OYAMA SHINGO

Application Number:

JP1498592A

Publication Date:

February 23, 1993

Filing Date:

January 30, 1992

Export Citation:

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Assignee:

ROHM CO LTD

International Classes:

B41J2/335; B41J2/345; (IPC1-7): B41J2/335

Attorney, Agent or Firm:

Akio Ishii (2 outside)

Next Patent: THERMAL PRINTING HEAD IMPROVED IN PRINTING DENSITY DIFFERENCE