Title:
プリプレグ及び積層板
Document Type and Number:
Japanese Patent JP4455806
Kind Code:
B2
Abstract:
The present invention is directed to a prepreg comprising a fiber base material impregnated with a resin composition which comprises a polyamide-imide resin and a thermosetting resin as essential components, and a metal-clad laminated sheet obtained by pressing the prepreg and a metal foil having a surface roughness: Rz<=3.0 together while heating. In addition, the present invention provides a heat-resistant laminated sheet which is excellent in micro-wiring formation properties, thermal shock resistance, reflow resistance, and crack resistance.
Inventors:
Kazumasa Takeuchi
Yuko Tanaka
Yuko Tanaka
Application Number:
JP2002150932A
Publication Date:
April 21, 2010
Filing Date:
May 24, 2002
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08J5/24; B32B15/08; B32B15/088; C08G18/34; C08G18/38; C08G73/10; C08L79/08; H05K1/03
Domestic Patent References:
| JP10338762A | ||||
| JP7076658A | ||||
| JP11217503A | ||||
| JP11263912A | ||||
| JP2003026939A | ||||
| JP11262974A | ||||
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| JP10075053A | ||||
| JP2001073171A | ||||
| JP2001217542A | ||||
| JP2000212309A | ||||
| JP11279414A | ||||
| JP1238932A |
Attorney, Agent or Firm:
Hajime Tsukuni
Koshiro Tsukuda
Masatoshi Ando
Koshiro Tsukuda
Masatoshi Ando