To provide a prepreg which, even if a sheet-like woven fabric of an inorganic fiber is used as a base material, enables to form through-holes easily and enhance the heat radiation characteristics as a whole by enhancing the heat conductivity in the thickness direction, and to provide a laminated board and a printed wiring board using the prepreg.
As the woven fabric of an inorganic fiber, use is made of the one formed of a fiber comprising a highly heat-conductive substance consisting of an insulating inorganic material that has a heat conductivity of ≥20 W/m×K. As the filler, use is made of the one having a heat conductivity of ≥20 W/m×K. As the thermosetting resin, use is made of the one which makes the heat conductivity of the layer obtained by molding the prepreg layer under heat and pressure to be ≥4 W/m×K.
KAWAHIRA TETSUYA
KANAI ATSUSHI
FUKUSHIMA KEIJI
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