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Title:
PREPREG AND LAMINATED PLATE HAVING INNER LAYER CIRCUIT OBTAINED BY USING THIS PREPREG
Document Type and Number:
Japanese Patent JP2003342399
Kind Code:
A
Abstract:

To provide a prepreg which enhances adhesive strength to a copper foil in an insulation layer having a p-aramid nonwoven fabric as the base material, and can contribute to further improvement of part mounting reliability, and a laminated plate having an inner layer circuit obtained by using this prepreg.

In the prepreg obtained by impregnating the p-aramid nonwoven fabric having a porosity of 30-55% as the base material with an epoxy resin composition comprising an epoxy resin, a curing agent, and a curing accelerator and semi-curing the impregnated p-aramid nonwoven fabric, in the outer layer of a copper foil directly laminated on the prepreg of a laminated plate having an inner circuit obtained by using the prepreg, sufficient copper foil adhesive strength can be stably secured and as a result, the prepreg can also contribute to the improvement of part mounting reliability.


Inventors:
FUJIKI TOMOYUKI
YONEMOTO KAMIO
ISHIDA TAKEHIRO
Application Number:
JP2002153531A
Publication Date:
December 03, 2003
Filing Date:
May 28, 2002
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B32B15/08; B32B15/088; B32B15/092; B32B15/14; C08G59/62; H05K1/03; H05K3/46; C08J5/24; (IPC1-7): C08J5/24; B32B15/08; B32B15/14; C08G59/62; H05K1/03; H05K3/46
Domestic Patent References:
JPH10338762A1998-12-22
JPH09324060A1997-12-16
JPH0812744A1996-01-16
JPH0582971A1993-04-02
JP2001212823A2001-08-07
Attorney, Agent or Firm:
Junji Ando