To provide a prepreg which enhances adhesive strength to a copper foil in an insulation layer having a p-aramid nonwoven fabric as the base material, and can contribute to further improvement of part mounting reliability, and a laminated plate having an inner layer circuit obtained by using this prepreg.
In the prepreg obtained by impregnating the p-aramid nonwoven fabric having a porosity of 30-55% as the base material with an epoxy resin composition comprising an epoxy resin, a curing agent, and a curing accelerator and semi-curing the impregnated p-aramid nonwoven fabric, in the outer layer of a copper foil directly laminated on the prepreg of a laminated plate having an inner circuit obtained by using the prepreg, sufficient copper foil adhesive strength can be stably secured and as a result, the prepreg can also contribute to the improvement of part mounting reliability.
JP2006007758 | COATED METAL SHEET USEFUL FOR BUSINESS EQUIPMENT |
JP3111577 | MANUFACTURE OF LAMINATE |
YONEMOTO KAMIO
ISHIDA TAKEHIRO
JPH10338762A | 1998-12-22 | |||
JPH09324060A | 1997-12-16 | |||
JPH0812744A | 1996-01-16 | |||
JPH0582971A | 1993-04-02 | |||
JP2001212823A | 2001-08-07 |