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Patent Searching and Data


Title:
PREPREG AND LAMINATED PLATE
Document Type and Number:
Japanese Patent JPH11207740
Kind Code:
A
Abstract:

To provide a prepreg which can obtain a laminated plate having high flexural strength.

A prepreg is obtained by a process in which a base material of liquid crystal polyester fibers is impregnated with an epoxy resin vernish containing an epoxy resin, a curing agent, and a solvent at the lowest 150°C in boiling point and bried. The content of the solvent having a boiling point of 150°C or higher in the prepreg is adjusted to be at the highest 0.2 wt.%. The base material is prevented from being corroded by the solvent having a boiling point of 150°C or higher.


Inventors:
ITO KOICHI
ISHIDA TAKEHIRO
FUJIKI TOMOYUKI
TARUKAWA KAZUHIRO
Application Number:
JP1455898A
Publication Date:
August 03, 1999
Filing Date:
January 27, 1998
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B29B11/16; B32B15/08; C08J5/24; C08K5/20; C08L67/03; C09D163/00; B29K63/00; B29K105/08; H05K1/03; (IPC1-7): B29B11/16; B32B15/08; C08J5/24; C08K5/20; C08L67/03; C09D163/00
Attorney, Agent or Firm:
Keisei Nishikawa (1 person outside)