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Patent Searching and Data


Title:
PREPREG MATERIAL FOR MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP01135841
Kind Code:
A
Abstract:

PURPOSE: To provide the above prepreg material containing polyimide films as one or more interleaf layers placed in parallel in a state essentially free from superposition of the films in the same layer, and enabling the production of a laminated composite material having high toughness and complicated shape.

CONSTITUTION: The objective prepreg material contains polyimide film tapes (preferably a tape having a width of 1W10mm, treated by corona discharge treatment and/or matte processing and having a tensile elongation at break of ≥90% at room temperature) as one or more interleaf layers placed in parallel in a state essentially free from superposition of the films in the same layer. The polyimide film tapes are preferably oriented in one direction in the same layer. The thickness of the polyimide film tape is most preferably 7W30μm.


Inventors:
Yamamoto, Shinji
Tanaka, Hideho
Fujii, Kazuyoshi
Application Number:
JP1987000291891
Publication Date:
May 29, 1989
Filing Date:
November 20, 1987
Export Citation:
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Assignee:
UBE IND LTD
International Classes:
C08J5/24; B32B3/10; B32B27/04; B32B27/08; B32B27/12; B32B27/34; B32B27/38; C08J5/24; B32B3/10; B32B27/04; B32B27/08; B32B27/12; B32B27/34; B32B27/38; (IPC1-7): B32B27/04; B32B27/08; B32B27/12; B32B27/38; C08J5/24