Title:
PREPREG, MULTILAYER PRINTED BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3506413
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a prepreg which solves problems in prior art, has good flexibility at room temperature, is free from resin stripping, and excellent in heat resistance and electrical insulation property after press-molding, a multilayer printed-wiring board using the prepreg having the excellent properties, and a method for manufacturing the multilayer printed-wiring board.
SOLUTION: This prepreg comprises a mixture of a polycarbodiimide resin and an epoxy resin and is in a form of a film, or comprises a mixture of a polycarbodiimide resin and an epoxy resin and a base material. In a multilayer printed-wiring board where an inner layer base plate and an insulating adhesive layer is alternately laminated and glued, the multilayer printed-wiring board uses the prepreg as the insulating adhesive layer. Further, in a manufacturing method for the multilayer printed-wiring board, the necessary part between the inner layer base plates is conducted, after the inner layer base plate and the prepreg are alternately laminated and glued.
Inventors:
Yasuo Imashiro
Takahiko Ito
Shuji Tomita
Norimasa Nakamura
Takahiko Ito
Shuji Tomita
Norimasa Nakamura
Application Number:
JP27141198A
Publication Date:
March 15, 2004
Filing Date:
September 25, 1998
Export Citation:
Assignee:
Nisshinbo Corporation
International Classes:
B29B11/16; B32B15/08; C08G18/02; C08G59/40; C08J5/24; C08L75/00; H05K3/46; C08L79/00; C08L79/04; H05K1/03; B29K105/06; (IPC1-7): C08J5/24; B32B15/08; C08G59/40; C08L75/00; H05K3/46
Domestic Patent References:
| JP621714A | ||||
| JP2218750A | ||||
| JP5320611A | ||||
| JP9227851A | ||||
| JP11121935A | ||||
| JP8100121A | ||||
| JP1067978A |
Attorney, Agent or Firm:
Masato Kobayashi