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Title:
PREPREG FOR PRESS MOLDING AND METHOD OF MANUFACTURING MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2014058692
Kind Code:
A
Abstract:

To provide a prepreg for press molding excellent in handleability at a room temperature, suppressing an excessive flow of a resin at high temperature high pressure molding almost without decreasing Tg and a curing rate, and suppressing poor appearance, performance failure, failure of mold and the like of an obtained molded article and method of manufacturing the molded article.

A prepreg for press molding is manufactured by impregnating an epoxy resin composition containing an epoxy resin (X), a polyether sulfone resin (Y) having a mass average molecular weight of 10,000 to 60,000 and an epoxy curing agent (Z), and having the lowest viscosity at 100 to 150°C of 2 to 20 Pa*s and the viscosity at 30°C of 10,000 to 100,000 Pa*s into a fiber reinforcement material. There is also provided a method of manufacturing a molded article using the prepreg for press molding.


Inventors:
SUZUMURA YASUSHI
KAZAHAYA YUJI
KAKIMOTO YOSHIHIDE
FURUYA SHINICHIRO
KIBA HISAO
TERASAWA NORIYOSHI
AKIYAMA KOICHI
Application Number:
JP2014000457A
Publication Date:
April 03, 2014
Filing Date:
January 06, 2014
Export Citation:
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Assignee:
MITSUBISHI RAYON CO
International Classes:
C08J5/24; C08K7/02; C08L63/00; C08L81/06
Domestic Patent References:
JP2004099814A2004-04-02
JP2003238657A2003-08-27
Foreign References:
WO2005082982A12005-09-09
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Suzuki Mitsuyoshi