To provide a prepreg useful in the manufacturing of a multilayer printed circuit board, low in dielectric constant and in dielectric loss tangent at high frequencies, high in processability, hardly causing powders to fall, and highly resistant to soldering heat after moisture absorption.
The prepreg is prepared by having a woven or nonwoven fabric, which contains liquid crystal polymer fibers as the constituent strands, carry a thermosetting resin composition whose molecule contains a cyanate compound having one or more cyanates but not an imide compound having more than one imide group. The thermosetting resin composition is low in dielectric constant and in dielectric loss tangent, high in flexibility, and may contain an additional resin component which is low in water absorption rate. It may also contain an inorganic filler which is not detrimental to the low dielectric constant/low dielectric loss tangent feature.
HIRAOKA KOICHI
KURUMAYA SHIGERU
NODA MASAYUKI
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