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Patent Searching and Data


Title:
PREPREG RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0625445
Kind Code:
A
Abstract:

PURPOSE: To obtain a prepreg resin composition improved in heat, impact and water resistances by mixing a specified aromatic polysulfone with a bisphenol epoxy resin, N,N,N',N'-tetraglycidyldiaminodiphenylmethane and diaminodiphenyl sulfone.

CONSTITUTION: 15-45wt.% aromatic polysulfone comprising at least 50mol% repeating units of formula I and at most 50mol% at least one kind of repeating unite selected from among those of formulas II-XVII and having a reduced viscosity of 0.35-0.6g/dl as measured in dimethylformamide in a concentration of 1g/dl at 30°C is mixed with 5-60wt.% bisphenol epoxy resin and 50-80wt.% N,N,N',N'-tetraglycidyldiaminodiphenylmethane. 0.7-1.3 equivalents (in terms of the amino group), per equivalent of the epoxy groups in the bisphenol epoxy resin, of a diaminodiphenyl sulfone is added to the obtained composition.


Inventors:
FUKAI TOMOHIRO
NAGAI YASUHIKO
Application Number:
JP18077392A
Publication Date:
February 01, 1994
Filing Date:
July 08, 1992
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08G59/50; C08G59/00; C08G59/40; C08J5/24; C08L63/00; C08L81/00; C08L81/06; (IPC1-7): C08J5/24; C08G59/50; C08L63/00; C08L81/06