To provide a prepreg that corresponds to film-thinning and allows adjustment of an amount of a resin according to a circuit pattern, a substrate having the prepreg, and a semiconductor device.
The prepreg 10 includes: a fiber base material 1 including glass fibers; a first resin layer 21 located on the one-surface side of the fiber base material 1; and a second resin layer 22 located on the other-surface side of the fiber base material 1. The thickness of the first resin layer 21 is different from that of the second resin layer 22. At least either one of the resin material 2, constituting the first resin layer 21, and the resin material 2, constituting the second resin layer 22, includes a resin composition containing at least one kind of thermosetting resin selected from among a cyanate resin, an epoxy resin, and a phenol resin.
BABA TAKAYUKI
YUASA MADOKA
| JP2003340952A | 2003-12-02 | |||
| JPH1034649A | 1998-02-10 | |||
| JPH09202834A | 1997-08-05 | |||
| JPH07216111A | 1995-08-15 | |||
| JP2011058004A | 2011-03-24 | |||
| JP2011068908A | 2011-04-07 |
| WO2004027136A1 | 2004-04-01 |
Kazuo Asahi
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